17 July 2012
Plasma-Therm providing plasma processing workshop at Cornell University
Plasma process equipment maker Plasma-Therm LLC of St Petersburg, FL, USA is providing a workshop at Cornell University in Ithaca, NY, USA on 21 August focusing on the ‘Fundamentals of Plasma Processing (Etching and Deposition)’.
Lectures will include the basics of plasma reactors and mechanisms for etching and deposition, and will review current plasma processing technologies as applied to semiconductor, micro-electro-mechanical systems (MEMS), and nanofabrication.
Talks will cover compound semiconductor, dielectric, and deep silicon etching as well as plasma-enhanced chemical vapor deposition (PECVD) and high-density plasma CVD (HDPCVD) of silicon-based materials. Essential concepts and new ideas for end-point detection and sample thermal budget management will be presented, along with an introduction to design-of-experiments (DOE) and a concluding presentation on designing robust processes.
Speakers include David Lishan, who received his Bachelor’s degree in Chemistry from University of California, Santa Cruz, and his M.S. and Ph.D. degrees from University of California, Santa Barbara, in Solid State Electrical Engineering. During his career he has worked and published on a wide range of material, semiconductor, and chemistry R&D projects in the areas of photochemistry, x-ray mask fabrication, physical vapor deposition (PVD), and plasma processing. Lishan joined Plasma-Therm nearly 14 years ago and is currently principal scientist and director in the Technical Marketing Group. His primary focus is on the application of plasma processing for MEMS, photonics, data storage, and compound semiconductor applications.
For registration inquiries, contact: Melanie-Claire Mallison at Mallison@cnf.cornell.edu.
Registration is free, however online pre-registration is required by 13 August.