19 December 2012
Rubicon awarded patent for ultra-flat, high-throughput wafer lapping
Rubicon Technology Inc of Bensenville, IL, USA, which makes monocrystalline sapphire substrates and products for the LED, RFIC, semiconductor and optical industries, says that the US Patent and Trademark Office (USPTO) has allowed Rubicon’s patent application ‘Ultra-Flat, High-Throughput Wafer Lapping Process’, which covers the firm’s process for performing grinding and polishing to achieve consistent, ultra-flat and defect-free surface quality for the high-volume production of large diameter sapphire wafers.
The patented ultra-flat, high-throughput lapping process enables high levels of flatness and quality while maintaining the highest levels of throughput in the production of large diameter sapphire wafers, says Rubicon. As wafers are lapped and polished, the platens facing the wafers become worn and deformed, leading to the deterioration of wafer quality. In the patented process, the platens are continuously self-conditioned and self-optimized to maintain high performance.
“This patent underscores our dedication to improving the large-diameter sapphire manufacturing process and improving the leading technology platform for the high-throughput production of high-quality large diameter sapphire wafers for our customers.” says Rubicon president & CEO Raja M. Parvez.