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StratEdge of San Diego, CA, USA, which designs and produces packages for microwave, millimeter-wave, and high-speed digital devices, has launched a family of small-outline thermally enhanced molded ceramic packages for power semiconductors, for use with silicon, silicon carbide, gallium nitride, and other compound semiconductors (e.g. amplifiers, discrete transistors, and diodes where greater than 0.5 Watt of power is consumed).
The thermally enhanced packages are designed for reliability and to mitigate the inherent stresses of brazing dissimilar materials together. All materials used in the packages have matched coefficients of expansion. They are assembled using a glass-to-metal seal process combined with gold germanium brazing, giving a rugged and reliable package. The packages can handle temperatures up to 360ºC. A hermetic seal provides enhanced reliability and offers protection from harsh environmental conditions, meeting military standard requirements. Packages are sealed with metal or ceramic lids that have gold-tin solder preforms.
Copper composite bases or copper inserts give enhanced thermal dissipation. Devices are mounted directly to the metal bases, providing an electric ground to the backside of the chip. StratEdge claims that the packages provide superior electrical performance for frequencies up to at least 6GHz. For controlled impedance devices, transition designs with higher-frequency performance can be used.
Packages are available in various shapes, sizes, and lead counts. All can be provided with gull-wing-shaped leads for surface mounting.
“These new packages, combined with our Power Package Series with thermally conductive beryllium oxide (BeO) ceramic, give our customers a variety of packages to choose from to package their high power devices,” said Timothy Going, president and CEO.
StratEdge’s new thermal power package will be on show at the IEEE MTT-S International Microwave Symposium (IMS 2008) in Atlanta, GA, USA (17-19 June).
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