WAFER PROCESSING

Achieve accurate and repeatable processing results with Logitech's semiconductor equipment.

Find out more about Logitech's wafer processing solutions

Johnson Matthey advert

 

FREE subscription
Subscribe for free to receive each issue of Semiconductor Today magazine and weekly news brief.

News

13 June 2008

 

LayTec In-situ Monitoring Award goes to Helmholtz Center’s Döscher

At the 14th International Conference on Metalorganic Vapor Phase Epitaxy (ICMOVPE 2008) in Metz, France last week, the inaugural LayTec In-situ Monitoring Award (together with a cheque for €1000) was presented by Thomas Zettler, president of in-situ optical sensor manufacturer LayTec GmbH of Berlin, Germany, to Henning Döscher for his outstanding contribution to “In-situ quantification of the surface domain structure of thin GaP films grown on Si(100)”.

The work is a result of the close collaboration of Henning Döscher and Thomas Hannappel of the Helmholtz-Center Berlin for Materials and Energy with Bernardette Kunert, Kerstin Volz and Wolfgang Stolz of Philipps-University Marburg, Germany.

Out of the many excellent contributions that applied for the prize, an independent committee recognized Döscher’s talk as a pioneering work in the fundamental research which will have a profound impact on future development of III-V semiconductors on Si substrates for future CMOS generations and solar cells.

LayTec’s In-situ Award will be granted every 2 years at the ICMOVPE to recognize outstanding results in the development and control of MOVPE processes by applying optical in-situ sensors and to further encourage their application both in research and industry.

See related item:

LayTec wafer curvature sensors sold for European R&D

Search: LayTec In-situ monitoring MOVPE MOCVD

Visit: www.laytec.de

Visit: www.movpe.umi2958.eu